Organic light-emitting display apparatus and method of manufacturing the same

ABSTRACT

Provided are an organic light-emitting display apparatus and a method of manufacturing the same. The organic light-emitting display apparatus includes: a substrate on which a display area is defined, wherein an image is displayed on the display area; a thin film transistor arranged on the display area of the substrate; a via-insulating layer covering the thin film transistor; a pixel electrode arranged on the via-insulating layer and electrically connected to the thin film transistor; a pixel-defining layer including an opening exposing a central portion of the pixel electrode, and covering an edge of the pixel electrode; a counter electrode facing the pixel electrode; an organic emission layer arranged between the pixel electrode and the counter electrode; a wire arranged on the via-insulating layer to be spaced apart from the pixel electrode and including a spacer area and a non-spacer area; and a spacer arranged on the spacer area.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of U.S. patent applicationSer. No. 15/449,532 filed on Mar. 3, 2017, which claims priority under35 U.S.C. § 119 of Korean Patent Application No. 10-2016-0026421, filedon Mar. 4, 2016, in the Korean Intellectual Property Office, thedisclosure of which is incorporated herein in its entirety by reference.

BACKGROUND 1. Field

One or more embodiments relate to an organic light-emitting displayapparatus and a method of manufacturing the same.

2. Description of the Related Art

Organic light-emitting display apparatuses are self-emitting typedisplay apparatuses that include an organic light-emitting device (OLED)including a hole injection electrode, an electron injection electrode,and an organic emission layer between the hole injection electrode andelectron injection electrode, wherein excitons, which are generated byholes injected from the hole injection electrode and electrons injectedfrom the electron injection electrode being united in the organicemission layer, emit light by falling from an excited state to a groundstate.

Organic light-emitting display apparatuses are self-emitting typedisplay apparatuses requiring no additional light sources, and thus,they may be driven by a low voltage, and may be formed to be thin andlightweight. Also, organic light-emitting display apparatuses haveexcellent characteristics, such as wide viewing angles, high contrast,and rapid response rates, all of which have drawn attention as nextgeneration display apparatuses.

SUMMARY

One or more embodiments include an organic light-emitting displayapparatus realizing high quality display at low expense, and a method ofmanufacturing the same.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to one or more embodiments, an organic light-emitting displayapparatus includes: a substrate on which a display area is defined,wherein the display area is configured to display an image; a thin filmtransistor arranged on the display area of the substrate; avia-insulating layer covering the thin film transistor; a pixelelectrode arranged on the via-insulating layer and electricallyconnected to the thin film transistor; a pixel-defining layer includingan opening exposing a central portion of the pixel electrode, andcovering an edge of the pixel electrode; a counter electrode facing thepixel electrode; an organic emission layer arranged between the pixelelectrode and the counter electrode; a wire arranged on thevia-insulating layer to be spaced apart from the pixel electrode andincluding a spacer area and a non-spacer area; and a spacer arranged onthe spacer area.

The spacer area may have a greater width than the non-spacer area.

The spacer may be arranged on a same layer as the pixel-defining layer.

A height of the spacer may be greater than a height of thepixel-defining layer.

The spacer may include a same material as the pixel-defining layer.

The spacer may completely cover the spacer area, and an end of thespacer area may be arranged between the via-insulating layer and thespacer.

The wire may include a contact hole, and the contact hole may be spacedapart from the spacer area.

The organic light-emitting display apparatus may further include awire-protection layer completely covering the non-spacer area of thewire and patterned to correspond to the non-spacer area.

A height of the spacer may be greater than a height of thewire-protection layer, and the spacer may be connected to thewire-protection layer and may include a same material as thewire-protection layer.

The pixel-defining layer may include a first inclination portionextending from an area where an upper surface of the pixel electrodecontacts the opening, and a second inclination portion extending fromthe first inclination portion to an area of an upper surface of thevia-insulating layer in a different inclination direction from the firstinclination portion.

A first angle between the pixel electrode and the first inclinationportion may be greater than a second angle between the via-insulatinglayer and the second inclination portion.

The organic light-emitting display apparatus may further include a thinfilm encapsulation layer arranged on the counter electrode and includingat least one inorganic layer and at least one organic layer.

The pixel-defining layer may include a photo-sensitive organic material.

According to one or more embodiments, a method of manufacturing anorganic light-emitting display apparatus includes: providing a substrateon which a display area is defined, wherein the display area isconfigured to display an image; forming a thin film transistor on thedisplay area of the substrate; forming a via-insulating layer coveringthe thin film transistor; forming a conductive material on thevia-insulating layer; forming a second insulating material on theconductive material; exposing the conductive material by irradiatinglight onto the second insulating material and removing a portion of thesecond insulating material; forming a pixel electrode and a wire that isspaced apart from the pixel electrode by etching an exposed portion ofthe conductive material; forming a pixel-defining layer covering an edgearea of the pixel electrode, and a spacer covering the wire, byreflowing the second insulating material; forming an organic emissionlayer on the pixel electrode; and forming a counter electrode on theorganic emission layer.

The wire may include a spacer area on which the spacer is formed, and anon-spacer area, and the spacer area may have a greater width than thenon-spacer area.

A height of the spacer may be greater than a height of thepixel-defining layer.

The wire may include a contact hole, and the contact hole may be spacedapart from the spacer area.

The method may further include forming a wire-protection layercompletely covering the non-spacer area of the wire and patterned tocorrespond to the non-spacer area.

The method may further include irradiating light onto the secondinsulating material, wherein the irradiating light onto the secondinsulating material includes irradiating light onto the secondinsulating material by using a half-tone mask including a transmissiveportion, a semi-transmissive portion, and a light shielding portion.

The method may further include, after forming the counter electrode,forming a thin film encapsulation layer including at least one inorganiclayer and at least one organic layer.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings in which:

FIG. 1A is a schematic plan view of an organic light-emitting displayapparatus according to an embodiment;

FIGS. 1B and 1C are cross-sectional views schematically showing astructure of an organic light-emitting display apparatus according to anembodiment;

FIG. 2 is an enlarged plan view of a portion of a display area of anorganic light-emitting display apparatus according to an embodiment;

FIG. 3A is a cross-sectional view taken along a line I-I of FIG. 2;

FIG. 3B is a cross-sectional view taken along a line II-II of FIG. 2;

FIGS. 4A, 4B, and 4C are schematic plan views of shapes of a wire whichmay be implemented in an organic light-emitting display apparatus,according to embodiments;

FIGS. 5A, 5B, 5C, 5D, 5E, 5F, 5G, and 5H are cross-sectional views forsequentially describing a method of manufacturing the organiclight-emitting display apparatus of FIG. 3A; and

FIG. 6 shows focused ion beam (FIB) images of sections of apixel-defining layer and a spacer which are manufactured according to anembodiment.

DETAILED DESCRIPTION

The present embodiments may have different forms and should not beconstrued as being limited to the descriptions set forth herein.Accordingly, the embodiments are merely described below, by referring tothe figures, to explain aspects of the present description. As usedherein, the term “and/or” includes any and all combinations of one ormore of the associated listed items. Expressions such as “at least oneof,” when preceding a list of elements, modify the entire list ofelements and do not modify the individual elements of the list.

It will be understood that although the terms “first,” “second,” etc.may be used herein to describe various components, these componentsshould not be limited by these terms. These components are only used todistinguish one component from another.

As used herein, the singular forms “a,” “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise.

It will be further understood that the terms “comprises” and/or“comprising” used herein specify the presence of stated features orcomponents, but do not preclude the presence or addition of one or moreother features or components.

Sizes of elements in the drawings may be exaggerated for convenience ofexplanation. In other words, since sizes and thicknesses of componentsin the drawings are arbitrarily illustrated for convenience ofexplanation, the following embodiments are not limited thereto.

When a certain embodiment may be implemented differently, a specificprocess order may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order.

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings, wherein like referencenumerals refer to like elements throughout, and repeated descriptionswill not be made.

FIG. 1A is a schematic plan view of organic light-emitting displayapparatuses 100 and 200 according to embodiments. FIGS. 1B and 1C arecross-sectional views schematically showing structures of the organiclight-emitting display apparatuses 100 and 200.

Referring to FIGS. 1A through 1C, the organic light-emitting displayapparatuses 100 and 200 may include a substrate 110 and a display part10 on the substrate 110, wherein the substrate 110 is divided into adisplay area DA on which an image is displayed, and a peripheral area PAaround the display area DA. An integrated circuit chip 15 may be mountedon the peripheral area PA of the substrate 110.

The display part 10 may include a thin film transistor (TFT), an organiclight-emitting device (OLED), a capacitor Cst, etc.

The display part 10 may further include signal lines, such as gate linesfor transmitting gate signals and data lines for transmitting datasignals. The display part 10 may display an image when a pixel is formedvia electrical connection of the thin film transistor TFT, the organiclight-emitting display device OLED, etc., wherein the thin filmtransistor TFT and the organic light-emitting display device OLED areconnected to the gate lines and the data lines. A plurality of thepixelx may be provided, and the plurality of pixels may be arranged invarious shapes. For example, the pixels may have a stripe arrangement, apentile arrangement, etc.

Referring to FIG. 1B, the organic light-emitting display apparatus 100may further include a thin film encapsulation layer 150. The thin filmencapsulation layer 150 may prevent external materials, such as water oroxygen, from penetrating through the display part 10, and may be formedto surround an upper surface and/or side surfaces of the display part10.

In some embodiments, the thin film encapsulation layer 150 may includean inorganic layer and/or an organic layer. The thin film encapsulationlayer 150 may be formed by alternately stacking a plurality of inorganiclayers and a plurality of organic layers. An uppermost layer of the thinfilm encapsulation layer 150, which is exposed to the outside, may beformed by using an inorganic layer, in order to prevent water vaporpermeation through the organic light-emitting display device OLED.

The inorganic layer may be a single layer or a stack including metaloxide or metal nitride. In detail, the inorganic layer may include atleast one of SiNx, Al₂O₃, SiO₂, and TiO₂.

The organic layer may be formed by using a polymer, and may be a singlelayer or a stack including at least one of polyethyleneterephthalate,polyimide, polycarbonate, epoxy, polyethylene, and polyacrylate.

In other embodiments, the thin film encapsulation layer 150 may have alayer structure including low melting glass, such as SnO.

Referring to FIG. 1C, the organic light-emitting display apparatus 200may further include a sealing substrate 250. The sealing substrate 250may prevent external oxygen and water from penetrating through thedisplay part 10. The sealing substrate 250 may include variousmaterials, such as transparent glass, ceramic, transparent plastic,metal, or the like. In some cases, a polarization film or a color filtermay further be provided on the sealing substrate 250.

Edges of the substrate 110 and the sealing substrate 250 are coupled toeach other via a sealing member 270. The sealing member 270 is arrangedto surround the display part 10. The sealing member 270 seals aninternal space 25 between the substrate 110 and the sealing substrate250. The sealing member 270 may prevent oxygen or water from beingintroduced into the display part 10 and bond the substrate 110 and thesealing substrate 250 to improve the device rigidity.

A moisture absorbent, an internal filler, etc. may be provided in theinternal space 25. The internal filler may protect the display part 10from shocks which may be applied to the display part 10 from theoutside.

The organic light-emitting display apparatuses 100 and 200 according tothe present embodiments include at least one spacer in the display part10. In the case of the organic light-emitting display apparatus 100 ofFIG. 1B, the spacer may be provided to prevent mask scratches during amask process. In the case of the organic light-emitting displayapparatus 200 of FIG. 1C, the spacer may be used not only to preventmask scratches during the process, but also to maintain a distancebetween the substrate 110 and the sealing substrate 250 and increase thedevice rigidity.

Hereinafter, the embodiments will be described in detail by referring toFIGS. 2 through 3B.

FIG. 2 is an enlarged plan view of a portion of the display area DA ofthe organic light-emitting display apparatus 100, FIG. 3A is across-sectional view taken along a line I-I of FIG. 2, and FIG. 3B is across-sectional view taken along a line II-II of FIG. 2.

Referring to FIG. 2, the organic light-emitting display apparatus 100includes a plurality of sub-pixels including the organic light-emittingdevice OLED. The plurality of sub-pixels may include a first sub-pixelSub_R, a second sub-pixel Sub_G, and a third sub-pixel Sub_B.

The first sub-pixel Sub_R may emit light of a red color, the secondsub-pixel Sub_G may emit light of a green color, and the third sub-pixelSub_B may emit light of a blue color. However, the first through thirdsub-pixels Sub_R, Sub_G, and Sub_B are not limited thereto. The firstsub-pixel Sub_R, the second sub-pixel Sub_G, and the third sub-pixelSub_B may emit light of different colors. For example, at least one ofthe first sub-pixel Sub_R, the second sub-pixel Sub_G, and the thirdsub-pixel Sub_B may emit light of a white color, etc.

The first sub-pixel Sub_R, the second sub-pixel Sub_G, and the thirdsub-pixel Sub_B may have different sizes, and the second sub-pixel Sub_Gmay have a lesser area than the first sub-pixel Sub_R or the thirdsub-pixel Sub_B. However, it is not limited thereto, and the firstsub-pixel Sub_R, the second sub-pixel Sub_G, and the third sub-pixelSub_B may have the same or substantially the same sizes. The firstsub-pixel Sub_R, the second sub-pixel Sub_G, and the third sub-pixelSub_B may have polygonal, circular, or oval shapes. The first sub-pixelSub_R, the second sub-pixel Sub_G, and the third sub-pixel Sub_B mayhave different shapes from one another.

One of each of the first sub-pixel Sub_R, the second sub-pixel Sub_G,and the third sub-pixel Sub_B may be included to form a pixel, or theymay be included in different numeral proportions to form a pixel.

The first sub-pixel Sub_R, the second sub-pixel Sub_G, and the thirdsub-pixel Sub_B may be arranged to have a stripe shape in which thefirst sub-pixel Sub_R, the second sub-pixel Sub_G, and the thirdsub-pixel Sub_B are arranged in series. Alternatively, the firstsub-pixel Sub_R, the second sub-pixel Sub_G, and the third sub-pixelSub_B may be arranged to have a diamond structure or a pentile structurein which the first sub-pixel Sub_R and the third sub-pixel Sub_B arealternately arranged at vertexes of a virtual quadrangle which has thesecond sub-pixel Sub_G as the center. In addition, the first sub-pixelSub_R, the second sub-pixel Sub_G, and the third sub-pixel Sub_B may bearranged to have a zig-zag shape, which is one example of variouspossible shapes.

A wire 170 including a spacer area 170 s is arranged among the pluralityof sub-pixels. The wire 170 may include, but is not limited to, variouswires, such as a data line, a scan line, a power supply line, aninitialization power line, etc. The wire 170 may include a contact hole170 c, and the wire 170 may exchange electrical signals with other wiresor other devices arranged on different layers, via the contact hole 170c.

The wire 170 may include the spacer area 170 s and a non-spacer area 170n. The spacer area 170 s is an area in which a spacer 180 is arranged,and the spacer area 170 s may include a width Ws that is greater than awidth W₀ of the non-spacer area 170 n in which the spacer 180 is notarranged. Also, the spacer area 170 s may have the width Ws that isgreater than a width Wp of a pixel-defining layer 140. In thisspecification, the width of the wire 170 denotes a planar verticallength of a main movement path of an electron, in which the electronmoves along the wire 170.

The width Ws of the spacer area 170 s may be variable, and may varyaccording to a shape of the spacer area 170 s.

The wire 170 may be patterned like a second insulating material 140′″ tobe described later, and the non-spacer area 170 n of the wire 170 may becovered by a wire-protection layer 181, and the spacer area 170 s of thewire 170 may be covered by the spacer 180. The spacer 180 may have agreater height than the wire-protection layer 181. This may be becausethe spacer area 170 s includes the width Ws which is greater than thewidth W₀ of the non-spacer area 170 n. More detailed aspects will bedescribed later.

The spacer area 170 s may not include the contact hole 170 c. When thecontact hole 170 c is arranged in the spacer area 170 s, the spacer 180may not be formed to be higher than the wire-protection layer 181.Accordingly, the spacer area 170 s and the contact hole 170 c may bearranged to be spaced apart from each other.

The spacer area 170 s may be arranged for each pixel including a set ofsub-pixels, or for one from every two or three pixels. Alternatively, aplurality of spacer areas 170 s may be included in one pixel.

Referring to FIG. 3A, the organic light-emitting display apparatus 100according to an embodiment includes the substrate 110, the thin filmtransistor TFT, a via-insulating layer 119, the organic light-emittingdevice OLED, the pixel-defining layer 140, the wire 170 including thespacer area 170 s, and the spacer 180. The organic light-emittingdisplay apparatus 100 may further include the thin film encapsulationlayer 150.

The substrate 110 may include various materials, such as glass, metal,or plastic. According to an embodiment, the substrate 110 may include aflexible substrate. Here, the flexible substrate refers to a substratewhich is easily bent, curved, folded, or rolled. The flexible substratemay include ultra-thin glass, metal, or plastic. For example, whenplastic is used, the substrate 110 may include polyimide (PI), but isnot limited thereto.

The substrate 110 may be divided into the display area DA and theperipheral area PA. In detail, the display area DA may be arranged at acentral portion of the substrate 110 and may display an image. Aplurality of pixels may be arranged on the display area DA, and theplurality of pixels may include sets of sub-pixels. Each of thesub-pixels includes the organic light-emitting device OLED for realizingan image.

The peripheral area PA may be arranged around the display area DA andmay be adjacent to an edge of the substrate 110. When the organiclight-emitting display apparatus 100 is sealed by the thin filmencapsulation layer 150, a dam portion, a groove, etc. may be arrangedon the peripheral area PA to suppress the flow of an organic material,and an integrated circuit chip may be arranged on the peripheral PA todrive the pixels.

A buffer layer 111 may be arranged on the substrate 110 to preventpenetration of impure elements and planarize a surface of the substrate110. The thin film transistor TFT may be arranged on the display area DAof the buffer layer 111. A barrier layer (not shown) may further bearranged between the substrate 110 and the buffer layer 111, and thebuffer layer 111 may be omitted as necessary.

The thin film transistor TFT may function as part of a driving circuitportion for driving the organic light-emitting device OLED. The drivingcircuit portion may further include a capacitor, a wire, etc. inaddition to the thin film transistor TFT.

The thin film transistor TFT may include an active layer 121 arranged onthe buffer layer 111, a gate electrode 122 arranged on at least aportion of the active layer 121, a source electrode 123 to which a datasignal is applied, and a drain electrode 124 electrically connected to apixel electrode 131. A gate insulating layer 113 may be arranged betweenthe active layer 121 and the gate electrode 122, and an interlayerinsulating layer 115 may be arranged between the gate electrode 122, andthe source electrode 123 and the drain electrode 124.

The active layer 121 may include a semiconductor material. For example,the active layer 121 may include amorphous silicon or polycrystallinesilicon. However, the present inventive concept is not limited thereto.The active layer 121 according to another embodiment may include anorganic semiconductor material or an oxide semiconductor material.

The gate electrode 122 may be connected to a gate wire (not shown)applying an on/off signal to the thin film transistor TFT, and mayinclude a low resistance metal material. For example, the gate electrode122 may be a single layer or multiple layers including a conductivematerial, such as Mo, Al, Cu, and/or Ti.

The source electrode 123 and the drain electrode 124 may be a singlelayer or multiple layers including a conductive material having highconductivity, and may be connected to a source area and a drain area ofthe active layer 121, respectively.

The thin film transistor TFT according to an embodiment may be a topgate type in which the gate electrode 122 is arranged on the activelayer 121. However, the present inventive concept is not limitedthereto. According to another embodiment, the thin film transistor TFTmay be a bottom gate type in which the gate electrode 122 is arrangedbelow the active layer 121.

The gate insulating layer 113 and the interlayer insulating layer 115may be a single layer or multiple layers including an inorganicmaterial. For example, the gate insulating layer 113 and the interlayerinsulating layer 115 may include SiO₂, SiN_(x), SiON, Al₂O₃, TiO₂,Ta₂O₅, HfO₂, and/or ZrO₂.

The buffer layer 111, the gate insulating layer 113, and the interlayerinsulating layer 115 may extend to a portion of the peripheral area PAbeyond the display area DA. According to an embodiment, the buffer layer111, the gate insulting layer 113, and the interlayer insulating layer115 may be arranged on areas of the substrate 110, except an outermostedge area.

The via-insulating layer 119 may cover the thin film transistor TFT, andremove a step difference due to the thin film transistor TFT, etc. andplanarize an upper surface of the thin film transistor TFT. Thevia-insulating layer 119 may be a single layer or multiple layersincluding an organic material. However, the present inventive concept isnot limited thereto, and the via-insulating layer 119 according toanother embodiment may be a combined stack of an inorganic insulatinglayer and an organic insulating layer.

The organic light-emitting device OLED may be arranged on thevia-insulating layer 119. The organic light-emitting device OLED mayinclude the pixel electrode 131 and a counter electrode 133 facing thepixel electrode 131. An organic emission layer 132 may be providedbetween the pixel electrode 131 and the counter electrode 133.

The pixel electrode 131 may be arranged on the via-insulating layer 119and may be electrically connected to the thin film transistor TFT via avia-hole VIA included in the via-insulating layer 119. The pixelelectrode 131 according to an embodiment is electrically connected tothe drain electrode 124. However, the present inventive concept is notlimited thereto, and the pixel electrode 131 according to anotherembodiment may be electrically connected to the source electrode 123.

The pixel electrode 131 may be formed by using a material having a highwork function. In the case of a bottom emission type in which an imageis displayed toward a bottom portion of the substrate 110, the pixelelectrode 131 may include at least one transparent conductive oxideselected from the group consisting of indium tin oxide (ITO), indiumzinc oxide (IZO), zinc oxide (ZnO), indium oxide (In₂O₃), indium galliumoxide (IGO), and aluminum zinc oxide (AZO).

According to another embodiment, in the case of a top emission type inwhich an image is displayed toward the counter electrode 133, the pixelelectrode 131 may further include a metal reflective layer including Ag,Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or the like, in addition to thetransparent conductive oxide.

The pixel-defining layer 140 may be arranged at an edge of the pixelelectrode 131, and the organic emission layer 132 may be arranged on amiddle portion of the pixel electrode 131. That is, the organic emissionlayer 132 may be arranged on an area of the pixel electrode 131, thearea not being covered by the pixel-defining layer 140.

The organic emission layer 132 may include a low molecular weightorganic material or a high molecular weight organic material, and atleast one of a hole injection layer, a hole transport layer, an electrontransport layer, and an electron injection layer may further be arrangedbetween the pixel electrode 131 and the counter electrode 133, inaddition to the organic emission layer 132. According to an embodiment,various other function layers may further be arranged between the pixelelectrode 131 and the counter electrode 133, in addition to the layersdescribed above.

The organic emission layer 132 may be arranged in each organiclight-emitting device OLED. In this case, according to a type of theorganic emission layer 132 included in the organic light-emitting deviceOLED, the organic light-emitting device OLED may emit light of a red,green, or blue color. However, the present inventive concept is notlimited thereto, and a plurality of organic emission layers 132 may beincluded in one organic light-emitting device OLED. For example, theplurality of organic emission layers 132 emitting light of red, green,and blue colors may be vertically stacked or combined to emit light of awhite color. In this case, a color conversion layer or a color filtermay further be provided to convert the emitted light of the white colorinto a predetermined color. The red, green, and blue colors areexamples, and the combination of colors for emitting the light of thewhite color is not limited thereto.

The counter electrode 133 may be arranged on the organic emission layer132, and the counter electrode 133 may include various conductivematerials. For example, the counter electrode 133 may includetransparent conductive metal oxide, such as ITO, IZO, ZnO, In₂O₃, IGO,AZO, etc. According to another embodiment, the counter electrode 133 mayinclude a thin film including at least one selected from Li, Ca, LiF/Ca,LiF/Al, Al, Ag, Mg, and Yb. The counter electrode 133 may be formed as asingle layer or multiple layers. In the case of the bottom emissiontype, the counter electrode 133 may be a reflection electrode, and inthe case of the top emission type, the counter electrode 133 may be atransparent or a semi-transparent electrode.

The counter electrode 133 may be formed such that a common voltage isapplied to all pixels. The counter electrode 133 may extend from anupper surface of the organic emission layer 132 to upper surfaces of thepixel-defining layer 140 and the spacer 180.

The pixel-defining layer 140 may include an opening 131 h covering theedge of the pixel electrode 131 and exposing the middle portion of thepixel electrode 131. The pixel-defining layer 140 may include a firstinclination portion 140 a extending from an area P1 at which an uppersurface of the pixel electrode 131 contacts the opening 131 h, and asecond inclination portion 140 b extending from the first inclinationportion 140 a to an area P2 of an upper surface of the via-insulatinglayer 119, in an inclination direction that is different from theinclination direction of the first inclination portion 140 a.

The first inclination portion 140 a may extend from the area P1 at whichthe upper surface of the pixel electrode 131 contacts the opening 131 htoward a direction in which the first inclination portion 140 a isdistanced from the substrate 110. The second inclination portion 140 bmay extend from the first inclination portion 140 a in a directiontoward the substrate 110. Here, the direction in which the firstinclination portion 140 a is distanced from the substrate 110 and thedirection in which the second inclination portion 140 b is toward thesubstrate 110 do not denote directions perpendicular to a principalplane of the substrate 110, but instead, may denote directions inclinedwith respect to the principal plane of the substrate 110 at apredetermined angle.

The pixel-defining layer 140 may be formed to surround the pixelelectrode 131 to expose the upper surface of the pixel electrode 131 andmay planarly have a doughnut shape or a polygonal frame shape. Thepixel-defining layer 140 may be a photo-sensitive organic layer, and mayinclude, for example, polyimide.

The pixel electrode 131 may be arranged at most areas between thepixel-defining layer 140 and the via-insulating layer 119, and an areaat which the pixel-defining layer 140 and the via-insulting layer 119directly contact each other may be very small compared to the areas atwhich the pixel-electrode 131 is arranged. That is, an end 131 a of thepixel electrode 131 and the area P2 of the upper surface of thevia-insulating layer 119 may be adjacent to each other.

The edge of the pixel electrode 131 may extend not only between thevia-insulating layer 119 and the first inclination portion 140 a of thepixel-defining layer 140, but also between the via-insulating layer 119and at least a portion of the second inclination portion 140 b of thepixel-defining layer 140. That is, the end 131 a of the pixel electrode131 may be between the via-insulating layer 119 and the secondinclination portion 140 b. A distance d1 between the area P1 of theupper surface of the pixel electrode 131 and the end 131 a of the pixelelectrode 131, which is covered by the pixel-defining layer 140, may begreater than a distance d2 between the area P2 of the upper surface ofthe via-insulating layer 119 and the end 131 a of the pixel electrode131.

According to an embodiment, a first angle 81 between the pixel electrode131 and the first inclination portion 140 a may be greater than a secondangle 82 between the via-insulating layer 119 and the second inclinationportion 140 b. The first angle 81 may be less than about 55 degrees, thesecond angle 82 may be less than about 40 degrees, and a differencebetween the first angle 81 and the second angle 82 may be equal to orgreater than about 5 degrees.

The first inclination portion 140 a and the second inclination portion140 b may have different inclinations, depending on areas thereof. Thefirst angle 81 includes inclination angles of the pixel-defining layer140 at the area P1 of the upper surface of the pixel electrode 131. Thesecond angle 82 includes inclination angles of the pixel-defining layer140 at the area P2 of the upper surface of the via-insulating layer 119.

Herewith, the first angle 81 and the second angle 82 may be defined byexcluding an area of the pixel-defining layer 140, at which thepixel-defining layer 140 extends substantially in parallel to thevia-insulating layer 119 and/or the pixel electrode 131 along the uppersurface of the via-insulating layer 119 and/or the upper surface of thepixel electrode 131. Being substantially parallel may denote that theangle between the first inclination portion 140 a of the pixel-defininglayer 140 and the pixel electrode 131 or the angle between the secondinclination portion 140 b of the pixel-defining layer 140 and thevia-insulating layer 119 is less than about 5 degrees.

The wire 170 may be arranged on the same layer as the pixel electrode131 to be spaced apart from the pixel electrode 131. The wire 170 may bearranged on the via-insulating layer 119. The wire 170 may includevarious wires, such as a data line, a scan line, a power supply line, aninitialization voltage line, an auxiliary wire electrically connected toa wire on a different layer, etc., and is not limited thereto. The wire170 may include the same material as the pixel electrode 131.

The wire 170 may include the spacer area 170 s (refer to FIG. 2), andthe spacer 180 is arranged on the spacer area 170 s. The spacer 180 maybe patterned to correspond to the spacer area 170 s and may completelycover the spacer area 170 s.

The spacer 180 has a shape protruding in a direction in which the spacer180 is distanced from the substrate 110. The spacer 180 may support amask during a mask process in a process of manufacturing the organiclight-emitting display apparatus 100. Also, when the organiclight-emitting device OLED is sealed by the encapsulation substrate 250(refer to FIG. 1C), the spacer 180 may support the mask and/or maintaina distance between the substrate 110 and the encapsulation substrate250. The spacer 180 may completely cover the spacer area 170 s of thewire 170 to protect the spacer area 170 s. An end 170 a of the wire 170is between the via-insulating layer 119 and the spacer 180. That is, thespacer 180 may cover an upper portion and a side surface of the wire 170so that the counter electrode 133 which may be formed on the spacer 180and the wire 170 are not shorted.

A height hs of the spacer 180 may be greater than a height hp of thepixel-defining layer 140. The spacer 180 may be formed to be spacedapart from the pixel-defining layer 140. However, the spacer 180 is notlimited thereto. For example, while a top of the spacer 180 and a top ofthe pixel-defining layer 140 are spaced apart from each other, a bottomof the spacer 180 and a bottom of the pixel-defining layer 140 maybe beconnected to each other.

The spacer 180 may include the same material as the pixel-defining layer140. The spacer 180 may be a photosensitive organic layer, and mayinclude, for example, polyimide. The spacer 180 may be formed on thesame layer as the pixel-defining layer 140.

Referring to FIG. 3B, the wire-protection layer 181 may be arranged onthe non-spacer area 170 n of the wire 170 to be patterned to correspondto the wire 170 and completely cover the non-spacer area 170 n. That is,the wire-protection layer 181 may cover the upper portion and the sidesurface of the wire 170 so that the counter electrode 133 which may beformed on the wire-protection layer 181 and the wire 170 are notshorted.

The spacer 180 and the wire-protection layer 181 are connected to eachother, and the height hs of the spacer 180 may be greater than a heighthn′ of the wire-protection layer 181.

The counter electrode 133 may be arranged on the spacer 180 and thewire-protection layer 181, and the thin film encapsulation layer 150 maybe arranged on the counter electrode 133 to seal the organiclight-emitting device OLED.

The thin film encapsulation layer 150 may include at least one organiclayer 151 and at least one inorganic layer 152. The thin filmencapsulation layer 150 may seal the organic light-emitting device OLEDso that the organic light-emitting device OLED is not exposed to air orexternal materials. Also, the thin film encapsulation layer 150 has avery small thickness, and thus, may be used as a sealing portion of aflexible display apparatus that is capable of being bent or folded.

According to an embodiment, the inorganic layer 152 may include oxide,nitride, or oxynitride, such as SiN_(x), SiO₂, or SiO_(x)N_(y). Theinorganic layer 152 may prevent or reduce the penetration of foreignmaterials, such as water or oxygen, into the organic light-emittingdevice OLED, and may extend from the display area DA to the peripheralarea PA.

According to an embodiment, a function layer (not shown) and aprotection layer (not shown) may further be arranged between the counterelectrode 133 and the thin film encapsulation layer 150. The functionlayer may include a capping layer (not shown) and/or an LiF layer (notshown) for improving the light efficiency by controlling a refractiveindex of visible light emitted from the organic light-emitting deviceOLED, and the protection layer may include an inorganic material, suchas aluminum oxide.

FIGS. 4A through 4C are schematic plan views of shapes of wires 171,172, and 173 which may be implemented in the organic light-emittingdisplay apparatus 100.

Spacer areas 171 s, 172 s, and 173 s of the wires 171, 172, and 173 mayhave various shapes. As illustrated in FIG. 4B, the spacer area 172 smay have curved edges. Alternatively, the spacer areas 171 s, 172 s, and173 s may have amorphous shapes. The spacer areas 171 s, 172 s, and 173s may have various shapes depending on the spatial arrangement withrespect to peripheral pixels.

The wires 171, 172, and 173 may include the spacer areas 171 s, 172 s,and 173 s, and non-spacer areas 171 n, 172 n, and 173 n. The spacerareas 171 s, 172 s, and 173 s may have widths Ws that are greater thanwidths W₀ of the non-spacer areas 171 n, 172 n, and 173 n. The widths Wsof the spacer areas 171 s, 172 s, and 173 s may be variable.

The wires 171, 172, and 173 may include contact holes 171 h, 172 h, and173 h, which may be spaced apart from the spacer areas 171 s, 172 s, and173 s. Widths Wh of the wires 171, 172, and 173 in which the contactholes 171 h, 172 h, and 173 h are arranged may be greater than thewidths W₀ of the non-spacer areas 171 n, 172 n, and 173 n. However, itis not limited thereto. The widths Wh of the wires 171, 172, and 173 inwhich the contact holes 171 h, 172 h, and 173 h are arranged may besubstantially the same as the widths W₀ of the non-spacer areas 171 n,172 n, and 173 n. In some embodiments, the widths Wh of the wires 171,172, and 173 in which the contact holes 171 h, 172 h, and 173 h arearranged may be less than a maximum width Ws_max of the spacer areas 171s, 172 s, and 173 s.

FIGS. 5A through 5H are cross-sectional views for sequentiallydescribing a method of manufacturing the organic light-emitting displayapparatus 100 of FIG. 3A.

Referring to FIG. 5A, the thin film transistor TFT may be formed on thesubstrate 110 including the display area DA (FIG. 1A) on which an imageis displayed.

In detail, the buffer layer 111 may be formed on the substrate 110, andthen, a semiconductor material may be patterned on the buffer layer 111to form the active layer 121. After the active layer 121 is formed, thegate insulating layer 113 may be formed on the active layer 121.Thereafter, a conductive material may be patterned on the gateinsulating layer 113 to form the gate electrode 122. The gate electrode122 may planarly overlap at least a portion of the active layer 121.

After the gate electrode 122 is formed, the interlayer insulating layer115 may be formed to cover the gate electrode 122, and at least twocontact holes C1 and C2 exposing the active layer 121 may be formed bysimultaneously etching the interlayer insulating layer 115 and the gateinsulating layer 113.

According to an embodiment, the active layer 121 may includepolycrystalline silicon, and areas of the active layer 121, which areexposed via the contact holes C1 and C2, may be the source area and thedrain area of the active layer 121. The source area and the drain areamay be doped polycrystalline silicon areas, that is, conductor areas.According to an embodiment, doping may be performed after the gateelectrode 122 is formed.

The buffer layer 111, the gate insulating layer 113, and the interlayerinsulating layer 115 may extend from the display area DA to theperipheral area PA, and the buffer layer 111, the gate insulating layer113, and the interlayer insulating layer 115 may be removed such that anedge of the substrate 110, which is in the peripheral area PA, isexposed. The removal of the buffer layer 111, the gate insulting layer113, and the interlayer insulating layer 115 for exposing the substrate110 in the peripheral area PA may be simultaneously performed with theformation of the contact holes C1 and C2.

After the contact holes C1 and C2 are formed, a conductive material maybe formed and patterned on the interlayer insulating layer 115 to formthe source electrode 123 and the drain electrode 124 respectivelyconnected to the source area and the drain area of the active layer 121.

Referring to FIG. 5B, after a first insulating material 119′ coveringthe thin film transistor TFT is formed on the substrate 110, the firstinsulating material 119′ may be patterned to form the via-insulatinglayer 119. The via-insulating layer 119 may be a single layer ormultiple layers including an organic material, and may include avia-hole VIA.

Referring to FIG. 5C, a conductive material 131′ and a second insulatingmaterial 140′″ may be formed on the via-insulating layer 119. Theconductive material 131′ may be at least one transparent conductiveoxide selected from the group consisting of ITO, IZO, ZnO, In₂O₃, IGO,and AZO. The conductive material 131′ may further include a metalreflective layer, such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, and Cr, inaddition to the transparent conductive oxide. The second insulatingmaterial 140′″ may include a photosensitive organic material, such aspolyimide.

Light may be irradiated onto the second insulating material 140′″ byusing a half-tone mask M, and the half-tone mask M may include atransmissive portion Md, light-shielding portions Mb and Mc, and asemi-transmissive portion Ma. The transmissive portion Md, thelight-shielding portions Mb and Mc, and the semi-transmissive portion Mamay respectively correspond to an area from which the conductivematerial 131′ is to be completely removed, an area on which the secondinsulating material 140′″ is to finally remain, and an area at which aportion of the second insulating material 140′″ is to remain and to beremoved by ashing.

Referring to FIG. 5D, the second insulating material 140′″ may becompletely removed by irradiating light thereon via the transmissiveportion Md, and then, the second insulating material 140′″ may bepartially removed by irradiating light thereon via the semi-transmissiveportion Ma. Thereafter, the conductive material 131′ exposed bycompletely removing the second insulating material 140′″ may be etchedto form the pixel electrode 131 and the wire 170.

Via the process described above, the pixel electrode 131, the wire 170,and the second insulating material 140′″ arranged and patterned on thepixel electrode 131 and the wire 170 may remain.

Referring to FIG. 5E, the patterned second insulating material 140′″ maybe partially removed via ashing. That is, the patterned second insultingmaterial 140′″ may have a reduced height due to ashing. The secondinsulating material 140′″ partially remaining by being irradiated withlight via the semi-transmissive portion Ma may be completely removed viaashing so as to expose a central portion of the pixel electrode 131.FIG. 5E illustrates the second insulating material 140′″ after ashing,wherein the end 131 a of the pixel electrode 131 and the end 170 a ofthe wire 170 may not be covered by the second insulating material 140′″.

Referring to FIG. 5F, heat may be applied to the second insulatingmaterial 140′″ after ashing, in order to reflow the second insulatingmaterial 140′″ to form the pixel-defining layer 140 which covers an edgeof the pixel electrode 131. That is, the second insulating material140′″ may leak through due to the thermal reflow to cover the end 131 aof the pixel electrode 131. When the end 131 a of the pixel electrode131 is exposed, the pixel electrode 131 may be shorted with respect tothe counter electrode 133 (FIG. 3G) formed by a sequential process. Toprevent the pixel electrode 131 from being shorted with respect to thecounter electrode 133, the reflow process may be performed so that thepixel-defining layer 1430 may cover the end 131 a of the pixel electrode131.

The second insulating material 140′″ remaining on the wire 170 afterashing may also leak through due to the reflow, and thus, the spacer 180and the wire-protection layer 181 (refer to FIG. 3B) completely coveringthe wire 170 may be formed. That is, the second insulating material140′″ may leak through due to the thermal reflow to cover the end 170 aof the wire 170. When the end 170 a of the wire 170 is exposed, the wire170 may be shorted with respect to the counter electrode 133 (FIG. 5G)formed by a sequential process. To prevent the wire 170 from beingshorted with respect to the counter electrode 133, the reflow processmay be performed so that the spacer 180 may cover the end 170 a of thewire 170.

According to a volume per unit length of the second insulating material140′ after ashing, a degree at which the second insulating material 140′leaks through may vary. That is, according to a shape of the patternedsecond insulating material 140′, the reflow degree may vary, and thus, aheight difference between the spacer 180 and the pixel-defining layer140 may be generated.

According to a shape of the wire 170, a volume per unit length of thespacer 180 may be greater than a volume per unit length of thepixel-defining layer 140. Accordingly, the height hs of the spacer 180may be greater than the height hp of the pixel-defining layer 140.Likewise, the height hs of the spacer 180 may be greater than the heighthn of the wire-protection layer 181 (refer to FIG. 3B).

That is, according to the method of manufacturing the organiclight-emitting display apparatus 100 according to an embodiment, thepixel electrode 131, the wire 170, the pixel defining layer 140, and thespacer 180 may be formed by using one mask. Thus, the manufacturingcosts may be reduced and the process may become less complex.

Referring to FIG. 5G, after the organic emission layer 132 is formed onan area of the pixel electrode 131, which is not covered by thepixel-defining layer 140, the counter electrode 133 may be formed on theorganic emission layer 132 to form the organic light-emitting deviceOLED. The counter electrode 133 may extend to an upper portion of thespacer 180.

The counter electrode 133 may be formed by a sputtering process, a vapordeposition process, a chemical vapor deposition (CVD) process, a pulselaser deposition process, a printing process, an atomic layer deposition(ALD) process, or the like. In some embodiments, the counter electrode133 may be formed such that a common voltage is applied to all pixels.

Referring to FIG. 5H, the thin film encapsulation layer 150 including atleast one inorganic layer 152 and at least one organic layer 151 may beformed on the counter electrode 133.

The inorganic layer 152 may include at least one material selected fromAlOx, SiNx, SiOx, SiON, ITO, AZO, ZnO, and ZrO. The inorganic layer 152may be deposited via various deposition methods, such as CVD, ALD,sputtering, etc.

The organic layer 151 may include any one of epoxy, acrylate, silicon,and polyacrylate. The organic layer 151 may be coated or deposited viaflash evaporation, inkjet printing, slot die coating, or the like.

FIG. 6 shows focused ion beam (FIB) images (a) and (b) of sections ofthe pixel-defining layer 140 and the spacer 180 manufactured accordingto an embodiment.

The pixel-defining layer 140 may be patterned to have a volume per unitlength that is less than a volume per unit length of the spacer 180, andthe pixel-defining layer 140 and the spacer 180 may be formed bysimultaneously performing reflow on the pixel-defining layer 140 and thespacer 180. It is shown that a height of the spacer 180 is greater thana height of the pixel-defining layer 140. A height difference betweenthe spacer 180 and the pixel-defining layer 140 may be controlledaccording to a shape, a size, etc. of the pattern.

As described above, according to the one or more of the aboveembodiments, according to the organic light-emitting display apparatuses100 and 200 and the method of manufacturing the organic light-emittingdisplay apparatuses 100 and 200, the number of masks may be reduced, andthus, the manufacturing costs may be reduced and the process may becomeless complex.

It should be understood that embodiments described herein should beconsidered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments.

While one or more embodiments have been described with reference to thefigures, it will be understood by those of ordinary skill in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope as defined by the following claims.

What is claimed is:
 1. A method of manufacturing an organiclight-emitting display apparatus, the method comprising: providing asubstrate on which a display area is defined, wherein the display areais configured to display an image; forming a thin film transistor on thedisplay area of the substrate; forming a via-insulating layer coveringthe thin film transistor; forming a conductive material on thevia-insulating layer; forming a second insulating material on theconductive material; exposing the conductive material by irradiatinglight onto the second insulating material and removing a portion of thesecond insulating material; forming a pixel electrode and a wire that isspaced apart from the pixel electrode by etching an exposed portion ofthe conductive material; forming a pixel-defining layer covering an edgearea of the pixel electrode, and a spacer covering the wire, byreflowing the second insulating material; forming an organic emissionlayer on the pixel electrode; and forming a counter electrode on theorganic emission layer; wherein a height between the via-insulatinglayer and a top of the spacer is greater than a height between thevia-insulating layer and a top of the pixel defining layer.
 2. Themethod of claim 1, wherein the wire comprises a spacer area on which thespacer is formed, and a non-spacer area, and the wire in the spacer areahas a greater width than the wire in the non-spacer area.
 3. The methodof claim 1, wherein the wire comprise a contact hole, and the contacthole is spaced apart from the spacer area.
 4. The method of claim 1,further comprising: forming a wire-protection layer completely coveringthe non-spacer area of the wire and patterned to correspond to thenon-spacer area.
 5. The method of claim 1, further comprising:irradiating light onto the second insulating material, wherein theirradiating light onto the second insulating material comprisesirradiating light onto the second insulating material by using ahalf-tone mask comprising a transmissive portion, a semi-transmissiveportion, and a light shielding portion.
 6. The method of claim 1,further comprising, after forming the counter electrode, forming a thinfilm encapsulation layer comprising at least one inorganic layer and atleast one organic layer.